{
 "dataset": "Korea Semiconductor Signal Dataset",
 "version": "0.1.0-sample",
 "generated_at": "2026-10-22",
 "note": "Sample extract. Every record is drawn from an existing VLSI pipeline file named in its source.locator; no invented figures. Amount ranges are as disclosed (OGE reports ranges only).",
 "record_count": 24,
 "records": [
  {
   "record_id": "sig-2026w40-hiring-index",
   "domain": "hiring",
   "event_type": "index_snapshot",
   "entity": {
    "name": "VLSI Semiconductor Hiring Index",
    "type": "index"
   },
   "event_date": "2026-10-04",
   "observed_at": "2026-10-19",
   "payload": {
    "week": "2026-W40",
    "index_value": 100.0,
    "stock_end": 54,
    "new_confirmed": 54,
    "new_provisional": 0,
    "closed": 0,
    "methodology": "stock-based; baseline 2026-10-03 = 100"
   },
   "labels": [
    "baseline_week"
   ],
   "source": {
    "name": "VLSI hiring-index pipeline",
    "locator": "goals/vlsi-korea-6/hidden_files/hiring-index/hiring-index-2026-10-19.json (job-posting-monitor cron aggregate)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-2026w41-hiring-index",
   "domain": "hiring",
   "event_type": "index_snapshot",
   "entity": {
    "name": "VLSI Semiconductor Hiring Index",
    "type": "index"
   },
   "event_date": "2026-10-11",
   "observed_at": "2026-10-19",
   "payload": {
    "week": "2026-W41",
    "index_value": 127.8,
    "stock_end": 69,
    "new_confirmed": 15,
    "new_provisional": 1,
    "closed": 1
   },
   "labels": [
    "index_rising"
   ],
   "source": {
    "name": "VLSI hiring-index pipeline",
    "locator": "goals/vlsi-korea-6/hidden_files/hiring-index/hiring-index-2026-10-19.json (job-posting-monitor cron aggregate)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-2026w42-hiring-index",
   "domain": "hiring",
   "event_type": "index_snapshot",
   "entity": {
    "name": "VLSI Semiconductor Hiring Index",
    "type": "index"
   },
   "event_date": "2026-10-18",
   "observed_at": "2026-10-19",
   "payload": {
    "week": "2026-W42",
    "index_value": 150.0,
    "stock_end": 81,
    "new_confirmed": 2,
    "new_provisional": 10,
    "closed": 0
   },
   "labels": [
    "index_rising",
    "provisional_heavy"
   ],
   "source": {
    "name": "VLSI hiring-index pipeline",
    "locator": "goals/vlsi-korea-6/hidden_files/hiring-index/hiring-index-2026-10-19.json (job-posting-monitor cron aggregate)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-2026w40-hiring-qualcomm",
   "domain": "hiring",
   "event_type": "company_snapshot",
   "entity": {
    "name": "Qualcomm",
    "type": "company"
   },
   "event_date": "2026-10-04",
   "observed_at": "2026-10-19",
   "payload": {
    "week": "2026-W40",
    "tracked_open_postings": 12,
    "note": "Largest single-company count in baseline week stock (54 total)"
   },
   "labels": [
    "baseline_week"
   ],
   "source": {
    "name": "VLSI hiring-index pipeline",
    "locator": "goals/vlsi-korea-6/hidden_files/hiring-index/hiring-index-2026-10-19.json (job-posting-monitor cron aggregate)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-pat-samsung-us20260231428a1",
   "domain": "patent",
   "event_type": "publication",
   "entity": {
    "name": "Samsung Electronics",
    "type": "company"
   },
   "event_date": "2026-08-06",
   "observed_at": "2026-10-16",
   "payload": {
    "publication_number": "US20260231428A1",
    "kind": "A1 (published application)",
    "title": "Semiconductor device including gate contact plugs and data storage system including the same"
   },
   "labels": [
    "theme:3d_nand_memory",
    "segment:memory"
   ],
   "source": {
    "name": "Google Patents",
    "locator": "goals/mau-50/hidden_files/patent-watch/reports/2026-10-16.md (Google Patents, verified live 2026-10-16)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-pat-skhynix-us12708044b2",
   "domain": "patent",
   "event_type": "publication",
   "entity": {
    "name": "SK hynix",
    "type": "company"
   },
   "event_date": "2026-08-11",
   "observed_at": "2026-10-16",
   "payload": {
    "publication_number": "US12708044B2",
    "kind": "B2 (grant)",
    "title": "Memory stack structure including power distribution structures",
    "note": "Base die + DRAM dies with power distribution = HBM stack engineering"
   },
   "labels": [
    "theme:hbm_stack",
    "segment:memory"
   ],
   "source": {
    "name": "Google Patents",
    "locator": "goals/mau-50/hidden_files/patent-watch/reports/2026-10-16.md (Google Patents, verified live 2026-10-16)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-pat-tsmc-de102025112481b4",
   "domain": "patent",
   "event_type": "publication",
   "entity": {
    "name": "TSMC",
    "type": "company"
   },
   "event_date": "2026-08-06",
   "observed_at": "2026-10-16",
   "payload": {
    "publication_number": "DE102025112481B4",
    "kind": "B4 (grant)",
    "title": "Method and structure for a wavelength multiplex by a grating copper array",
    "priority_date": "2024-12-23",
    "note": "Photonic engine: photonic die + grating couplers + microlenses (COUPE lineage)"
   },
   "labels": [
    "theme:silicon_photonics",
    "segment:foundry"
   ],
   "source": {
    "name": "Google Patents",
    "locator": "goals/mau-50/hidden_files/patent-watch/reports/2026-10-16.md (Google Patents, verified live 2026-10-16)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-pat-intel-us20260228165a1",
   "domain": "patent",
   "event_type": "publication",
   "entity": {
    "name": "Intel",
    "type": "company"
   },
   "event_date": "2026-08-06",
   "observed_at": "2026-10-16",
   "payload": {
    "publication_number": "US20260228165A1",
    "kind": "A1 (published application)",
    "title": "Die-to-die adapter",
    "note": "Chiplet port with UCIe-based die-to-die link"
   },
   "labels": [
    "theme:chiplet_uicie",
    "segment:foundry"
   ],
   "source": {
    "name": "Google Patents",
    "locator": "goals/mau-50/hidden_files/patent-watch/reports/2026-10-16.md (Google Patents, verified live 2026-10-16)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-pat-micron-us12707628b2",
   "domain": "patent",
   "event_type": "publication",
   "entity": {
    "name": "Micron Technology",
    "type": "company"
   },
   "event_date": "2026-08-11",
   "observed_at": "2026-10-16",
   "payload": {
    "publication_number": "US12707628B2",
    "kind": "B2 (grant)",
    "title": "Memory device having 2-transistor vertical memory cell and a common plate",
    "note": "2T vertical memory cell = 3D DRAM / capacitorless DRAM direction"
   },
   "labels": [
    "theme:3d_dram_gain_cell",
    "segment:memory"
   ],
   "source": {
    "name": "Google Patents",
    "locator": "goals/mau-50/hidden_files/patent-watch/reports/2026-10-16.md (Google Patents, verified live 2026-10-16)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-pat-skhynix-thememix-20261019",
   "domain": "patent",
   "event_type": "theme_mix",
   "entity": {
    "name": "SK hynix",
    "type": "company"
   },
   "event_date": "2026-10-19",
   "observed_at": "2026-10-19",
   "payload": {
    "window": "baseline: 2026-08-01..2026-10-19 reports",
    "theme_shares": {
     "hbm_stack": 0.3,
     "pim_compute_in_memory": 0.2,
     "wafer_bonding_packaging": 0.2,
     "3d_nand": 0.15,
     "memory_hierarchy_new_tier": 0.15
    },
    "note": "Relevance-sampled directional estimate, not full CPC census (per STATE.json methodology note)"
   },
   "labels": [
    "theme:hbm_stack",
    "theme:pim_compute_in_memory"
   ],
   "source": {
    "name": "VLSI patent-watch STATE",
    "locator": "goals/mau-50/hidden_files/patent-watch/STATE.json"
   },
   "confidence": "estimated",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-inv-trump-amd-20260821",
   "domain": "investor_disclosure",
   "event_type": "disclosed_trade",
   "entity": {
    "name": "Donald Trump (OGE 278-T filer)",
    "type": "person"
   },
   "event_date": "2026-08-21",
   "observed_at": "2026-10-08",
   "payload": {
    "ticker": "AMD",
    "direction": "sell",
    "amount_range_usd": [
     1000000,
     5000000
    ],
    "filing": "OGE 278-T, August 2026 period, published 2026-10-08",
    "note": "Single transaction; baseline analysis reads it as effectively an exit"
   },
   "labels": [
    "segment:fabless",
    "signal:position_exit"
   ],
   "source": {
    "name": "OGE Form 278-T via VLSI investor-tracking baseline",
    "locator": "goals/mau-50/hidden_files/investor-tracking/trump-august-2026-baseline.md (OGE Form 278-T)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-inv-trump-nvda-20260817",
   "domain": "investor_disclosure",
   "event_type": "disclosed_trade",
   "entity": {
    "name": "Donald Trump (OGE 278-T filer)",
    "type": "person"
   },
   "event_date": "2026-08-17",
   "observed_at": "2026-10-08",
   "payload": {
    "ticker": "NVDA",
    "direction": "buy",
    "amount_range_usd": [
     500000,
     1000000
    ],
    "filing": "OGE 278-T, August 2026 period, published 2026-10-08"
   },
   "labels": [
    "segment:fabless",
    "signal:net_buy_small"
   ],
   "source": {
    "name": "OGE Form 278-T via VLSI investor-tracking baseline",
    "locator": "goals/mau-50/hidden_files/investor-tracking/trump-august-2026-baseline.md (OGE Form 278-T)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-inv-trump-mu-202608",
   "domain": "investor_disclosure",
   "event_type": "disclosed_trade_aggregate",
   "entity": {
    "name": "Donald Trump (OGE 278-T filer)",
    "type": "person"
   },
   "event_date": "2026-08-31",
   "observed_at": "2026-10-08",
   "payload": {
    "ticker": "MU",
    "direction": "net_sell",
    "net_amount_range_usd": [
     251000,
     515000
    ],
    "period": "2026-08 (monthly aggregate of disclosed trades)"
   },
   "labels": [
    "segment:memory",
    "signal:net_sell"
   ],
   "source": {
    "name": "OGE Form 278-T via VLSI investor-tracking baseline",
    "locator": "goals/mau-50/hidden_files/investor-tracking/trump-august-2026-baseline.md (OGE Form 278-T)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-inv-trump-mrvl-202607",
   "domain": "investor_disclosure",
   "event_type": "disclosed_trade",
   "entity": {
    "name": "Donald Trump (OGE 278-T filer)",
    "type": "person"
   },
   "event_date": "2026-07-31",
   "observed_at": "2026-09-22",
   "payload": {
    "ticker": "MRVL",
    "direction": "buy",
    "amount_range_usd": [
     1000000,
     5000000
    ],
    "filing": "OGE 278-T, July 2026 period, published 2026-09-22",
    "note": "July filing showed semiconductor buying (MRVL, NVDA) before August rotation away"
   },
   "labels": [
    "segment:fabless",
    "signal:position_open"
   ],
   "source": {
    "name": "OGE Form 278-T via VLSI investor-tracking baseline",
    "locator": "goals/mau-50/hidden_files/investor-tracking/trump-august-2026-baseline.md (OGE Form 278-T)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-inv-trump-filing-202608",
   "domain": "investor_disclosure",
   "event_type": "filing_snapshot",
   "entity": {
    "name": "Donald Trump (OGE 278-T filer)",
    "type": "person"
   },
   "event_date": "2026-10-08",
   "observed_at": "2026-10-08",
   "payload": {
    "filing": "OGE 278-T, August 2026 period",
    "total_trades": 517,
    "buys": 289,
    "sells": 228,
    "total_amount_range_usd": [
     74300000,
     273300000
    ],
    "disclosure_lag": "~7 weeks (trade -> publication)"
   },
   "labels": [
    "baseline_filing"
   ],
   "source": {
    "name": "OGE Form 278-T via VLSI investor-tracking baseline",
    "locator": "goals/mau-50/hidden_files/investor-tracking/trump-august-2026-baseline.md (OGE Form 278-T)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-earn-micron-fy26q4",
   "domain": "earnings",
   "event_type": "earnings_disclosure",
   "entity": {
    "name": "Micron",
    "type": "company",
    "ticker": "MU"
   },
   "event_date": "2026-09-30",
   "observed_at": "2026-10-16",
   "payload": {
    "period": "FY2026-Q4",
    "revenue_usd_bn": 54.23,
    "revenue_yoy_pct": 379,
    "detail": "Core Data Center $18.0B (+11x YoY), 90% gross margin. HBM3E/HBM4 sold out through 2027, 2028 supply being locked; CEO guided demand to exceed supply in 2027 and 2028."
   },
   "labels": [
    "segment:memory",
    "product:hbm",
    "signal:supply_sold_out"
   ],
   "source": {
    "name": "Micron earnings release/call via VLSI market-data",
    "locator": "workspace/market-data/earnings_asp.json (company earnings releases/calls)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-earn-market-dram-q4f",
   "domain": "earnings",
   "event_type": "market_forecast_disclosure",
   "entity": {
    "name": "DRAM market (conventional)",
    "type": "market"
   },
   "event_date": "2026-10-03",
   "observed_at": "2026-10-16",
   "payload": {
    "period": "2026-Q4 forecast",
    "detail": "Q4 2026 conventional DRAM contract +10~15% QoQ, NAND +15~20% QoQ expected. Enterprise SSD bit demand +80% YoY in 2026.",
    "original_source": "TrendForce (as recorded in VLSI earnings_asp dataset)"
   },
   "labels": [
    "segment:memory",
    "signal:contract_price_up"
   ],
   "source": {
    "name": "VLSI earnings_asp dataset",
    "locator": "workspace/market-data/earnings_asp.json (company earnings releases/calls)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-earn-samsung-hbm4-ask",
   "domain": "earnings",
   "event_type": "reported_price_signal",
   "entity": {
    "name": "Samsung Electronics",
    "type": "company",
    "ticker": "005930.KS"
   },
   "event_date": "2026-10-02",
   "observed_at": "2026-10-16",
   "payload": {
    "metric": "Samsung HBM4 2027 asking price",
    "unit": "USD_per_Gb",
    "value_range": [
     4.5,
     4.9
    ],
    "detail": "Reported (Maeil Business exclusive, unnamed industry sources; not an official Samsung disclosure): mid-to-high $4/Gb for 2027 annual contracts, ~3x HBM3E (~$1.50/Gb). Unit is Gb (gigabit), not GB."
   },
   "labels": [
    "segment:memory",
    "product:hbm",
    "signal:price_up_3x"
   ],
   "source": {
    "name": "VLSI hbm_reported dataset",
    "locator": "workspace/market-data/hbm_reported.json"
   },
   "confidence": "reported",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-mkt-samsung-20261022",
   "domain": "market",
   "event_type": "daily_bar",
   "entity": {
    "name": "Samsung Electronics",
    "type": "company",
    "ticker": "005930.KS"
   },
   "event_date": "2026-10-22",
   "observed_at": "2026-10-22",
   "payload": {
    "close": 223000,
    "currency": "KRW",
    "open": 221500,
    "high": 226000,
    "low": 220000,
    "volume": 1928754,
    "reference_close_1y_ago": {
     "date": "2025-10-22",
     "close": 98600
    }
   },
   "labels": [
    "exchange:KSC"
   ],
   "source": {
    "name": "VLSI market-data pipeline",
    "locator": "workspace/market-data/stocks/<slug>.json (Yahoo Finance daily bars, VLSI collect_stocks.py)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-mkt-skhynix-20261022",
   "domain": "market",
   "event_type": "daily_bar",
   "entity": {
    "name": "SK hynix",
    "type": "company",
    "ticker": "000660.KS"
   },
   "event_date": "2026-10-22",
   "observed_at": "2026-10-22",
   "payload": {
    "close": 1283000,
    "currency": "KRW",
    "open": 1273000,
    "high": 1297000,
    "low": 1267000,
    "volume": 427070,
    "reference_close_1y_ago": {
     "date": "2025-10-22",
     "close": 481500
    }
   },
   "labels": [
    "exchange:KSC"
   ],
   "source": {
    "name": "VLSI market-data pipeline",
    "locator": "workspace/market-data/stocks/<slug>.json (Yahoo Finance daily bars, VLSI collect_stocks.py)"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-mkt-mover-screen-20261022",
   "domain": "market",
   "event_type": "mover_event",
   "entity": {
    "name": "Screen Holdings",
    "type": "company",
    "ticker": "7735.T"
   },
   "event_date": "2026-10-22",
   "observed_at": "2026-10-22",
   "payload": {
    "threshold_pct": 5,
    "direction": "down",
    "cause_label": "wafer cleaning (per published mover article slug)",
    "published_article_slug": "screen-holdings-juga-5-harag-iyu-wafer-sejeong",
    "note": "Mover detected by hourly-movers scan: intraday move >=5% vs prior close, computed from last two daily bars"
   },
   "labels": [
    "signal:mover_down"
   ],
   "source": {
    "name": "VLSI hourly-movers + trend-radar hot_stocks",
    "locator": "goals/mau-50/hidden_files/trend-radar/2026-10-22.json"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-mkt-mover-tower-20261021",
   "domain": "market",
   "event_type": "mover_event",
   "entity": {
    "name": "Tower Semiconductor",
    "type": "company",
    "ticker": "TSEM"
   },
   "event_date": "2026-10-21",
   "observed_at": "2026-10-22",
   "payload": {
    "threshold_pct": 5,
    "direction": "down",
    "cause_label": "earnings take-profit / AI funds (per published mover article slug)",
    "published_article_slug": "taweosemikeondeogteo-juga-5-haraeg-iyu-siljeog-chaig-ai-jagum"
   },
   "labels": [
    "signal:mover_down"
   ],
   "source": {
    "name": "VLSI hourly-movers + trend-radar hot_stocks",
    "locator": "goals/mau-50/hidden_files/trend-radar/2026-10-22.json"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-att-naver-skhynix-buyback-20261022",
   "domain": "attention",
   "event_type": "news_attention",
   "entity": {
    "name": "SK hynix",
    "type": "company",
    "ticker": "000660.KS"
   },
   "event_date": "2026-10-22",
   "observed_at": "2026-10-22",
   "payload": {
    "channel": "Naver popular news",
    "headline": "SK하이닉스, 40조 규모 자사주 매입 완료…예정보다 한 달 빨라",
    "note": "Headline as captured verbatim in trend-radar Naver popular-news list, 2026-10-22 10:18 KST"
   },
   "labels": [
    "signal:buyback_completed",
    "channel:naver"
   ],
   "source": {
    "name": "VLSI trend-radar daily",
    "locator": "goals/mau-50/hidden_files/trend-radar/2026-10-22.json"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  },
  {
   "record_id": "sig-pred-memory-squeeze-20261016",
   "domain": "prediction",
   "event_type": "forecast_ledger",
   "entity": {
    "name": "Memory supply/demand",
    "type": "market"
   },
   "event_date": "2026-10-16",
   "observed_at": "2026-10-16",
   "payload": {
    "prediction": "Memory supply tightness persists through end-2027 (AI data-center demand structurally outruns smartphone demand)",
    "status": "pending",
    "timeframe": "2027-12-31"
   },
   "labels": [
    "segment:memory",
    "status:pending"
   ],
   "source": {
    "name": "VLSI predictions ledger",
    "locator": "goals/vlsi-korea-6/hidden_files/predictions/ledger.json"
   },
   "confidence": "verified",
   "license_note": "Internal research use. Redistribution per tier terms; raw third-party data not resold."
  }
 ]
}